LHCb VELO Upgrade
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The upgraded LHCb VELO silicon vertex detector is a lightweight hybrid pixel detector capable of 40 MHz readout at a luminosity of 2 x 1033 cm-2 s-1. The track reconstruction speed and precision is enhanced relative to the current VELO detector even at the high occupancy conditions of the upgrade, due to the pixel geometry and a closest distance of approach to the LHC beams of just 5.1 mm for the first sensitive pixel. Cooling is provided by evaporative CO2 circulating microchannel cooling substrates. The detector contains 41 million 55 μm × 55 μm pixels, read out by the custom developed VeloPix front end ASIC. The detector will start operation together with the rest of the upgraded LHCb experiment after the LHC LS2 shutdown, currently scheduled to end in 2019. The VELO upgrade has been described in the Technical Design Report , submitted in November 2013 which lays out the planned construction and installation, and gives an overview of the expected detector performance. Some key figures and diagrams related to the VELO Upgrade can be found on our collection at Material for Presentations. |
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The Velo Upgrade Project operates under the responsibility of the VELO Project leader
Paula Collins and deputy project leader
Kazu Akiba Some practical links are given in the table below. The project is organised into workpackages which are given in the list below.
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Upgrade Software
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Electronics
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DAQ Integration
VELOPIX ASICÂ
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Module
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Module CoolingÂ
- Malcolm John, Workpackage webpage here
- Velo Upgrade cooling meetings are held weekly at 10 am Monday CET and can be searched in indico under "Velo Upgrade Cooling". In addition the "LHCb CO2 Cooling meetings" discuss the general status of the joint cooling plant development for the UT and Velo Upgrade.
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MechanicsÂ
- Girish Patel, here
- The responsibility for this workpackage after the retirement of Girish Patel is taken over by Kurt Rinnert and Themis Bowcock pending the appointment of the new workpackage coordinator, expected for Q2 2016
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RF boxes
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Sensor activity
The VELO upgrade baseline option is for planar sensors, approximately 200 um thick. In the past, 3d and diamond sensors have been considered. Â
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Testbeam
The VELO upgrade testbeam programme is very active, coordinated by
Kazu Akiba and Martin van Beuzekom
Please find the twiki page
here
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VeloUpgradeCommissioning
The decision to replace the Phase I VELO Strip detector with pixels was adopted in 2013 at a dedicated
technology review held at Nikhef, Amsterdam. Some workpackages were dedicated to the concept development and R&D for this review, and have now been completed. This includes the workpackage setting in place the
Strawman Defintion workpackage and the investigations of alternative pixel sensor technologies incuding 3D (
Presentation by Chris Parkes on 3D detectors
) and diamond sensors which were not in the end adopted for the Upgrade. Considerable work was put into the development of a strip option, which is described at the technology review links given above. The initial descriptions of the development of hybrid pixel modules, based on the electronics chip "VeloPix" derived from Timepix2, as a baseline option was described in our LOI
and developed in the Framework TDR
. The VELO Institutes committed to involvement in various aspects of the VELO Upgrade activities by completing a survey velo_expression_of_interest_4.xlsx and some technical information about the simulation studies can be found here.The old R&D pages can be found here.
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Timepix/Medipix
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Material for Presentations
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- Plan of activities in the pit: