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VELO Upgrade Project Database

The online database can be found here: Database External link mark

 

Module Summary Page Column Key

Key Process   Key Test
ABM Assemble Bare Module   PI Photo-Inspection (x9)
GTC Glue Tiles C-side   SF Substrate Flatness Test
GTN Glue Tiles N-side   TF Tile Flatness Test
GHC Glue Hybrids C-side   GT Glue Thickness Test
GHN Glue Hybrids N-side   TP Tile Position Test
WBC Wire-bond Hybrids C-side   HP Hybrid Placement Test
WBN Wire-bond Hybrids N-side   P1 Wire-bond Pull Test (before thermal cycling)
ALV Attach Low Voltage Harness   P2 Wire-bond Pull Test (after thermal cycling)
      E1 Electrical Test Set (before thermal cycling )
      D1 Displacement Test (after tightening VCR)
      D2 Displacement Test (after pump-down)
      D3 Displacement Test (after cool-down)
      E2 Electrical Test Set (after thermal cycling)

 

Module Summary Page Cell Key

Letter Key Description
P Pending The process/test has not been performed yet
Z Pending The process/test exists, but has not yet been graded
A Pending The process/test is of highest quality - Grade A
B Pending The process/test has minor issues - Grade B
C Pending The process/test has more substantial issues - Grade C
F Pending The process/test has failed the QA procedure - Grade F
M Pending There are multiple instances of this test for the given module; one must be selected for QA

 

Module Quality Assurance Tests

 

Photo-Inspection (PI)

Photo-Inspections are tests that follow every major perturbation of the module. There are 9 obligatory instances of Photo-Inspections distinguished by the 'Time of Inspection field containing a drop-down menu with the following values:

  • after bare module assembly;
  • after tile gluing;
  • after hybrid gluing;
  • after wire-bonding;
  • after low voltage attachment;
  • after QA at the module production site;
  • final photo-inspection (finished module);
  • before travel to Liverpool;
and an instance that can be used to upload a Photo-Inspection at any time:
  • other (specify in Summary Report!).
  The PI object requires the upload of at least a one image to the image field, however the recommendation is that at least one image per side is uploaded. The maximum number of individually uploadable and hence displayable images is four; for further upload of images and/or explanatory text documents the TarBall upload field should be used. The uploaded images can be either regular pictures or, if relevant, thermal camera, tomography, x-ray or other type of images.

A PI is a user discretion test, meaning that no auto-grading procedures are available. Instead, the user must select one of four grades available:

  • All OK;
  • Insignificant issue;
  • Critical issue;
which correspond to Grades A, B and F, respectively.

When filling out the test for the first time, or anytime when changing the grade, entering additional information in the 'Summary Report' field is mandatory. Failure to do so will result in changes not being saved and a warning message requesting that changes be made being displayed.  

 

Substrate Flatness Test (SF)

In order to enter this test the user is required to upload an appropriate file to DataFile field for a Manchester measurement or DataFile and DataFileN for a NIKHEF measurement. Failure to upload DataFileN for a NIKHEF measurement will result in an error message being displayed whereas upload of a DataFileN for Manchester measurement will result in the file simply being ignored.

Upon saving the test object, the 'Flatness Map' field will be populated with a single plot for a Manchester measurement or two individual plots, for either side of the substrate, for a NIKHEF measurement. If a Keyence measurement has previously been uploaded for the Substrate object used in the assembly, an additional plot, 2nd for Manchester and 3rd for NIKHEF, respectively, will be displayed.

The non-editable quartile fields will be populated automatically upon saving the object, q0-q4 for Manchester, q0-q4 and q0N-q4N for NIKHEF. These denote the deviation of the offset of 0%, 25%, 50%, 75% and 100% of the points from the mean, ie. 100% of all points are above q0 and below q4, 50% of the points are above q1 and below q3 and 50% of the points are both above and below q2. Fields q1 (and q1N) and q3 (and q3N) are used for auto-grading the test at Manchester (NIKHEF) using the following requirements:

  • if q1 (and q1N) is above 50 microns and q3 (and q3N) is below 50 microns - Grade A
  • if q1 (and q1N) is above 75 microns and q3 (and q3N) is below 75 microns - Grade B
  • if q1 (and q1N) is above 100 microns and q3 (and q3N) is below 100 microns - Grade C
  • if q1 (or q1N) is above 100 microns or q3 (or q3N) is above 100 microns - Grade F
To override the automatic grading the 'block automatic grading' tick-box can be used:
  • Un-tick 'block automatic grading'
  • Click 'Save and continue editing'
  • Change grade field to the desired grade
  • Click 'Save'
 

Tile Flatness Test (TF)

NB! Tile Flatness test and Glue Thickness test are created at the same time, when one is uploaded, the other is created automatically; if this is not desired, upon the upload other user should un-tick the 'Tile Flatness' ('Glue Thickness') field.

In order to enter this test the user is required to upload an appropriate file to DataFile field. *For measurement performed at NIKHEF, a SF test must be uploaded beforehand as the data from it is used to infer values of this test.

Upon saving the test object, the 'Flatness Map' field will be populated four plots displaying the flatness of the four individual tiles

The non-editable 'mean' and 'stdev'fields will be populated automatically upon saving the object. These denote the mean and standard deviation of the flatness of each tile and are used for auto-grading the test using the following requirements:

  • if 2 times 'stdev' is below 20 microns for all tiles - Grade A
  • if 2 times 'stdev' is below 40 microns for all tiles - Grade B
  • if 2 times 'stdev' is below 60 microns for all tiles - Grade C
  • if 2 times 'stdev' is above 60 microns for one or more tiles - Grade F
To override the automatic grading the 'block automatic grading' tick-box can be used:
  • Un-tick 'block automatic grading'
  • Click 'Save and continue editing'
  • Change grade field to the desired grade
  • Click 'Save'
  

 

Glue Thickness Test (GT)

NB! Glue Thickness test and Tile Flatness test are created at the same time, when one is uploaded, the other is created automatically; if this is not desired, upon the upload other user should un-tick the 'Glue Thickness' ('Tile Flatness') field.

In order to enter this test the user is required to upload an appropriate file to DataFile field. *For measurement performed at NIKHEF, a SF test must be uploaded beforehand as the data from it is used to infer values of this test.

Upon saving the test object, the 'Flatness Map' field will be populated four plots displaying the glue layer thickness of the four individual tiles

The non-editable 'mean' and 'stdev'fields will be populated automatically upon saving the object. These denote the mean and standard deviation of the glue layer thickness of each tile and are used for auto-grading the test using the following requirements:

  • if mean - 2 times 'stdev' is above 40 microns is above and mean + 2 times 'stdev' is below 120 microns for all tiles - Grade A
  • if mean - 2 times 'stdev' is above 30 microns is above and mean + 2 times 'stdev' is below 150 microns for all tiles - Grade B
  • if mean - 2 times 'stdev' is above 20 microns is above and mean + 2 times 'stdev' is below 180 microns for all tiles - Grade C
  • if mean - 2 times 'stdev' is below 20 microns is above or mean + 2 times 'stdev' is above 180 microns for one or more tiles - Grade F
To override the automatic grading the 'block automatic grading' tick-box can be used:
  • Un-tick 'block automatic grading'
  • Click 'Save and continue editing'
  • Change grade field to the desired grade
  • Click 'Save'
 

Tile Position Test (TP)

In order to enter this test the user is required to upload an appropriate file to DataFile field.

The non-editable fields denoting the tile and sensor markers and tile and sensor marker deltas will be populated automatically upon saving the object. The markers position values are contained in the uploaded data file whereas the deltas are calculated against hardcoded values for these positions given in the table below:

Tile left-x left-y right-x right-y
CLI -11.069 41.433 18.993 11.371
CSO 51.273 1.464 21.21 -28.599
NSI 11.487 -18.876 41.55 11.186
NLO 27.744 22.066 -2.319 52.128
 
Sensor left-x left-y right-x right-y
NSI -0.237 -6.923 -0.237 -7.7
CLI -22.794 29.479 -22.794 30.257

 The values of deltas are used for auto-grading the test using the following requirements:

  • if all deltas are below 30 microns - Grade A
  • if all deltas are below 45 microns - Grade B
  • if all deltas are below 60 microns - Grade C
  • if one or more deltas are above 60 microns - Grade F
To override the automatic grading the 'block automatic grading' tick-box can be used:
  • Un-tick 'block automatic grading'
  • Click 'Save and continue editing'
  • Change grade field to the desired grade
  • Click 'Save'
 

Hybrid Placement Test (HP)

In order to enter this test the user is required to upload 8 images - the inner and outer end of showing the gap between the tile and the hybrid for each front-end hybrid - where 'inner' and 'outer' denotes the closest to the beamline and farthest from the beamline ends of the tile/hybrid, respectively.

A HP is a user discretion test, meaning that no auto-grading procedures are available. Instead, the user must select one of four grades available:

  • A - production grade;
  • B - nsignificant issues;
  • C - moderate issues;
  • F - QA failure.
When filling out the test for the first time, or anytime when changing the grade, entering additional information in the 'Summary Report' field is mandatory. Failure to do so will result in changes not being saved and a warning message requesting that changes be made being displayed.  

 

Wire-bond Pull Test (P1 and P2)

In order to enter this test the user is required to upload an appropriate file to DataFile field and select the time of the test using the 'Time of test' drop-down: 'before thermal cycling' (P1) or 'after thermal cycling' (P2).

Upon saving the test object, the uploaded data file will be used to create a number of 'Single Wire-bond Pull Tests' as 'inlines' for the parent 'Wire-bond Pull Test'. The individual single wire-bond pull tests will store the following information:

  • tile, asic and the wire-number of the wire pulled;
  • breakage weight;
  • breakage location;
  • 'Fixed' tick-box;
  • Grade for the individual wire: Pass/Fail<5g/Fail<2g
The database user can use the 'Fixed' tick-box to signal that the given 'Single Wire-bond Pull Test' is either fixed or to be ignored; if the 'Fixed' box is ticked for an individual test, it will not be used for any further grading procedures. The grade for the individual wire designates if it has passed the test - "Pass" (not broken or broken with a weight above 5 grams), "Fail<5g" (broken with a weight below 5 grams but above 2 grams), "Fail<2g" (broken with a weight below 2 grams). Wires graded "Fail<5g" and "Fail<2g" are later categorized as "Suspect" and "Failed" bonds, respectively.

The non-editable grade fields for the individual tiles are populated automatically upon saving the object. The individual tiles are graded using the following requirements:

  • if no wire breaks below 5 grams for the corresponding tile: A - production grade;
  • if if one or more wires break bewlo 5 grams but no wire breaks below 2 grams for the corresponding tile: B - wire-failure <5g;
  • if no more than one wire breaks below 2 grams for the corresponding tile: C - wire-failure <2g;
  • if more than one wire breaks below 2 grams for the corresponding tile: F - QA failure;
the overall test is then graded according to the lowest grade for the individual tiles.

To override the automatic grading the 'block automatic grading' tick-box can be used:

  • Un-tick 'block automatic grading'
  • Click 'Save and continue editing'
  • Change grade field to the desired grade
  • Click 'Save'
 

 

Module Test Grading Summary Table

Test Grade Key Description
Photo-Inspection (PI) A All OK auto-grading not applicable
  B Insignificant issue auto-grading not applicable
  F Critical issue auto-grading not applicable
  Z Not Graded The test has not yet been assigned a grade (default)
 
Substrate Flatness Test (SF) A A - production grade 50% of the points are within +/-50 microns of the mean
  B B - insignificant issues 50% of the points are within +/-75 microns of the mean
  C C - moderate issues 50% of the points are within +/- 100 microns of the mean
  F QA failure Less than 50% of the points are within +/- 100 microns of the mean
  Z Not Graded The test has not yet been assigned a grade (default)
 
Tile Flatness Test (TF) A A - production grade 2 times standard deviation is within 20 microns for all tiles
  B B - insignificant issues 2 times standard deviation is within 40 microns for all tiles
  C C - moderate issues 2 times standard deviation is within 60 microns for all tiles
  F F - QA failure 2 times standard deviation is more than 60 microns for one or more tiles
  Z Not Graded The test has not yet been assigned a grade (default)
 
Glue Thickness Test (GT) A A - production grade Mean - 2 times standard deviation is more than 40 and mean + 2 times standard deviation is less than 120 microns for all tiles
  B B - insignificant issues Mean - 2 times standard deviation is more than 30 and mean + 2 times standard deviation is less than 150 microns for all tiles
  C C - moderate issues Mean - 2 times standard deviation is more than 20 and mean + 2 times standard deviation is less than 180 microns for all tiles
  F F - QA failure Mean - 2 times standard deviation is less than 20 and mean + 2 times standard deviation is more than 180 microns for one or more tiles
  Z Not Graded The test has not yet been assigned a grade (default)
 
Tile Position Test (TP) A A - production grade All position deltas are lower than 30 microns
  B B - insignificant issues All position deltas are lower than 45 microns
  C C - moderate issues All position deltas are lower than 60 microns
  F F - QA failure One or more position deltas are above 60 microns
  Z Not Graded The test has not yet been assigned a grade (default)
 
Hybrid Placement Test (TP) A A - production grade auto-grading not applicable
  B B - insignificant issues auto-grading not applicable
  C C - moderate issues auto-grading not applicable
  F F - QA failure auto-grading not applicable
  Z Not Graded The test has not yet been assigned a grade (default)
 
Wire-bond Pull Test (P1, P2) A A - production grade No wire breakage below 5 grams
  B B - wire failure < 5g One or more suspect bonds; bond classed as suspect if its breakage weight is between 2 and 5 grams
  C C - wire failure < 2g One or more failed bonds; bond is classed as failed if its breakage weight is below 2 grams
  F F - QA failure One or more tiles with multiple failed bonds
  Z Not Graded The test has not yet been assigned a grade (default)
 
Displacement Test (D1, D2, D3) A Grade A Displacement at sensors D1 and D4 is less than 50 microns ( D1 and D2), 100 microns ( D3)
  B Grade B Displacement at sensors D1 and D4 is less than 80 microns ( D1 and D2), 150 microns ( D3)
  C Grade C Displacement at sensors D1 and D4 is less than 100 microns ( D1 and D2), 200 microns ( D3)
  F Grade F Displacement at sensors D1 and D4 is more than 100 microns ( D1 and D2), 200 microns ( D3)
  Z Not Graded The test has not yet been assigned a grade (default)
 
Thermal Cycling (TC) A All OK auto-grading not applicable
  Z Bad auto-grading not applicable
 
Electrical Test (E1,E2) Grade determined by the worst graded test from the five tests below
 
Communications Test A Grade A auto-grading not implemented
  B Grade B auto-grading not implemented
  C Grade C auto-grading not implemented 
  F Grade F auto-grading not implemented
  Z Not Graded The test has not yet been assigned a grade (default)
 
Timing and Fast Control Test A Grade A auto-grading not implemented
  B Grade B auto-grading not implemented
  C Grade C auto-grading not implemented
  F Grade F auto-grading not implemented
  Z Not Graded The test has not yet been assigned a grade (default)
 
PRBS Test A Grade A No links with an error rate above 1E-12 
  B Grade B One or more links with error rate above 1E-12; no two such links on the same tape; no links with error rate above 1E-10
  C Grade C Multiple links with error rate above 1E-12, including multiple on the same tape; no links with error rate above 1E-10
  F Grade F One or more links with error rate above 1E-10
  Z Not Graded The test has not yet been assigned a grade (default)
 
Noise and Equalisation Test A Grade A auto-grading not implemented
  B Grade B auto-grading not implemented
  C Grade C auto-grading not implemented
  F Grade F auto-grading not implemented
  Z Not Graded The test has not yet been assigned a grade (default)
 
IV Curves A Grade A auto-grading not implemented 
  B Grade B auto-grading not implemented
  C Grade C auto-grading not implemented
  F Grade F auto-grading not implemented
  Z Not Graded The test has not yet been assigned a grade (default)
 
Cooling Performance (bandgap) A Grade A All Asics show ΔT ≤ 6 ℃ at 26W
  B Grade B All Asics near to the beam (VP2-Asic0, VP0-Asic0/1/2 ) with ΔT ≤ 6 ℃ , others ΔT ≤ 8 ℃ at 26W
  C Grade C At most one Asic near the beam shows 6 ℃ > ΔT ≤ 8 ℃ , others ΔT ≤ 8 ℃ at 26W
  F Grade F More than one Asic near the beam shows 6 ℃ > ΔT or any Asic shows ΔT > 8 ℃ at 26W
  Z Not Graded The test has not yet been assigned a grade (default)

 

 

 

 

 

 

 

 

 

-- Main.KarlisDreimanis - 2019-08-09

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Topic revision: r8 - 2021-03-29 - psvihra
 

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