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50 Recent Changes in VELO Web retrieved at 08:35 (GMT)

T14 (T35 450 P4) Description 200 m 3 x 1 n on p sensor from Hamamatsu bump bonded to Timepix3 ASICs. 450 m inactive edge, 35 m implant width. Parylene ...
VELO Upgrade sensor simulations Installing Sentaurus TCAD Step 1: Setting up an Openstack virtual machine Perfom the steps below by using this tutorial ...
T11 (T35 450 P9) Description 200 m 3 x 1 n on p sensor from Hamamatsu bump bonded to Timepix3 ASICs. 450 m inactive edge, 35 m implant width. Parylene ...
T13 (T35 450 P3) Description 200 m 3 x 1 n on p sensor from Hamamatsu bump bonded to Timepix3 ASICs. 450 m inactive edge, 35 m implant width. Parylene ...
S25 (MS 450 P3) Description Timepix3 W0005 F09 with 200 m n on p sensor from Micron. 450 m inactive edge, 36 m implant width. Parylene coated (before ...
S31 (MS 250 P1) Description Timepix3 W0009 E7 with 200 m n on p sensor from Micron. 250 m inactive edge, 36 m implant width. Parylene coated (before ...
S23 (MS 450 P1) Description Timepix3 W0009 H11 with 200 m n on p sensor from Micron. 450 m inactive edge, 36 m implant width. Parylene coated (before ...
S24 (MS 450 P2) Description Timepix3 W0009 G04 with 200 m n on p sensor from Micron. 450 m inactive edge, 36 m implant width. Parylene coated (before ...
T12 (T35 450 P10) Description 200 m 3 x 1 n on p sensor from Hamamatsu bump bonded to Timepix3 ASICs. 450 m inactive edge, 35 m implant width. Parylene ...
S6 (S39 450 P1) Description Timepix3 W0009 F10 with 200 m n on p sensor from Hamamatsu. 450 m inactive edge, 39 m implant width. Glued on ceramic ...
ATTENTION! ATTENTION! ATTENTION! ATTENTION! ATTENTION! ATTENTION! ATTENTION! RUN PLAN FOR S24! MICRON n on p JSI IRRADIATED ATTENTION! ATTENTION! ATTENTION ...
ATTENTION! ATTENTION! ATTENTION! ATTENTION! ATTENTION! ATTENTION! ATTENTION! RUN PLAN FOR S6! HAMAMATSU COATED JSI IRRADIATED ATTENTION! ATTENTION! ATTENTION ...
VELO Upgrade Testbeam 2014/2015 Test beam coordination: Hella Snoek / Kazu Akiba (2015) Technical coordination: Martin van Beuzekom Kepler coordination: Tim Evans ...
KazuyoshiCarvalhoAkiba 2015 07 27 ATTENTION! ATTENTION! ATTENTION! ATTENTION! ATTENTION! ATTENTION! ATTENTION! RUN PLAN FOR S23! MICRON n on p JSI IRRADIATED ATTENTION ...
Test beam analysis Topic Group Person Comments Clusters Charge sharing, broken clusters Bristol Noisy/dead pixels CERN Mark ...
S4 (S39 600 P1) Description Timepix3 W0009 D10 with 200 m n on p sensor from Hamamatsu. 600 m inactive edge, 39 m implant width. Parylene coated ...
T1 (T35 450 P1) Description 200 m 3 x 1 n on p sensor from Hamamatsu bump bonded to Timepix3 ASICs. Chip positions 450 m inactive edge, 35 m ...
T2 (T35 450 P1) Description 200 m 3 x 1 n on p sensor from Hamamatsu bump bonded to Timepix3 ASICs. Chip positions 450 m inactive edge, 35 m ...
T21 (MT 450 P5) Description 150 m 3 x 1 n on n sensor from Micron bump bonded to Timepix3 ASICs. Chip positions 450 m inactive edge, 36 m implant ...
T6 (T35 600 P1) Description 200 m 3 x 1 n on p sensor from Hamamatsu bump bonded to Timepix3 ASICs. Chip positions 600 m inactive edge, 35 m ...
S16 (S35 450 P1) Description Timepix3 W0009 D03 with 200 m n on p sensor from Hamamatsu. 450 m inactive edge, 35 m implant width. Glued on ceramic ...
S34 (MS 250 P2) Description Timepix3 W0002 G01 with 150 m n on n sensor from Micron. 250 m inactive edge, 36 m implant width. Glued on ceramic substrate ...
S30 (MS 450 P4) Description Timepix3 W0005 K03 with 150 m n on n sensor from Micron. 450 m inactive edge, 36 m implant width. Glued on ceramic substrate ...
S11 (S39 450 P2) Description Timepix3 W0009 H06 with 200 m n on p sensor from Hamamatsu. 450 m inactive edge, 39 m implant width. Parylene coated ...
S8 (S35 450 P3) Description Timepix3 W0009 G08 with 200 m n on p sensor from Hamamatsu. 450 m inactive edge, 35 m implant width. Parylene coated ...
S27 (MS 450 P1) Description Timepix3 W0005 H01 with 150 m n on n sensor from Micron. 450 m inactive edge, 36 m implant width. Glued on ceramic substrate ...
S22 (S35 450 P1) Description Timepix3 W0009 J02 with 200 m n on p sensor from Hamamatsu. 450 m inactive edge, 35 m implant width. Parylene coated ...
S33 (MS 250 P1) Description Timepix3 W0002 H04 with 150 m n on n sensor from Micron. 250 m inactive edge, 36 m implant width. Glued on ceramic substrate ...
T15 (MT 450 P1) Description 200 m 3 x 1 n in p sensor from Micron bump bonded to Timepix3 ASICs. 450 m inactive edge, 36 m implant width. Parylene ...
T17 (MT 450 P5) Description 200 m 3 x 1 n in p sensor from Micron bump bonded to Timepix3 ASICs. 450 m inactive edge, 36 m implant width. Parylene ...
S14 (S39 450 P1) Description Timepix3 W0009 F04 with 200 m n on p sensor from Hamamatsu. 450 m inactive edge, 39 m implant width. Glued on ceramic ...
KazuyoshiCarvalhoAkiba 2015 07 25 ATTENTION! ATTENTION! ATTENTION! ATTENTION! ATTENTION! ATTENTION! ATTENTION! RUN PLAN FOR T1! IRRADIATED AT KIT HAMAMATSU SENSOR ...
KazuyoshiCarvalhoAkiba 2015 07 25 ATTENTION! ATTENTION! ATTENTION! ATTENTION! ATTENTION! ATTENTION! ATTENTION! RUN PLAN FOR S30! MICRON N ON N NON IRRADIATED ...
KazuyoshiCarvalhoAkiba 2015 07 25 ATTENTION! ATTENTION! ATTENTION! ATTENTION! ATTENTION! ATTENTION! ATTENTION! RUN PLAN FOR S16! IRRADIATED AT KIT HAMAMATSU SENSOR ...
Lab Information (working progress....) Location, Location, Location Location of Equalisation Scripts /home/timepix3/SPIDR/SPIDR/software/trunk/Telescope ...
ATTENTION! ATTENTION! ATTENTION! ATTENTION! ATTENTION! ATTENTION! ATTENTION! RUN PLAN FOR S30! MICRON N ON N NON IRRADIATED 450 GUARD RINGS ATTENTION! ATTENTION ...
T10 (T35 450 P6) Description 200 m 3 x 1 n on p sensor from Hamamatsu bump bonded to Timepix3 ASICs. 450 m inactive edge, 35 m implant width. Parylene ...
Shift start/end When you start your shift inform yourself by talking to the previousshift. What happened, where are they in the run plan, are there special instructions ...
VELO Data Quality Testbeam and Zap Testbeam 2006 2007 2008 2009 2011 2012 2014/2015 High Rate Tests 2008 ...
Velo Upgrade Technology Review: May 22 23 Nikhef Amsterdam agenda page Repository Document to guide referees through review process preliminary version referee ...
LHCb VELO Upgrade The upgraded LHCb VELO silicon vertex detector is a lightweight hybrid pixel detector capable of 40 MHz readout at a luminosity of 2 x 1033 ...
Theses and Reports Tuomas Poikela of Turku PhD Thesis Veerle Heijne Nikhef Master Thesis Atreyi Bhattacharya Indian Summer Student Report Tuomas ...
Conference Presentations and Posters (VELO and LHCb Upgrade) Pawel Jalocha, Jan Buytaert, Malcolm John, on the LHCb VELO evaporative CO2 microchannel cooling ...
S26 (MS 450 P4) Description Timepix3 W0005 I03 with 200 m n on p sensor from Micron. 450 m inactive edge, 36 m implant width. Parylene coated (before ...
Shift Schedule July 2015 Provisional shift times: DAY: 8:00 17:00 EVE: 17:00 02:00 (on the next day) Wed 08 Thu 09 Fri 10 Sat 11 Sun 12 Mon ...
VELO Upgrade Conference Material This page is updated with useful figures and diagrams for preparing presentations. Many figures come from the Upgrade TDR, which is ...
T16 (MT 450 P2) Description 200 m 3 x 1 n in p sensor from Micron bump bonded to Timepix3 ASICs. 450 m inactive edge, 36 m implant width. Parylene ...
T18 (MT 450 P4) Description 200 m 3 x 1 n in p sensor from Micron bump bonded to Timepix3 ASICs. 450 m inactive edge, 36 m implant width. Parylene ...
T8 (T35 450 P3) Description 200 m 3 x 1 n on p sensor from Hamamatsu bump bonded to Timepix3 ASICs. 450 m inactive edge, 35 m implant width. Parylene ...
T9 (T35 450 P4) Description 200 m 3 x 1 n on p sensor from Hamamatsu bump bonded to Timepix3 ASICs. 450 m inactive edge, 35 m implant width. Parylene ...
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Topic revision: r1 - 2006-11-15 - TWikiContributor
 

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