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50 Recent Changes in VELO Web retrieved at 22:27 (GMT)

Running Vetra and Lovell There are two new GUIs that will replace the old VeloMoniGUI data quality monitor. One is browser based, the web GUI , and the other is ...
Welcome to the LHCb VELO Twiki pages VELO Web pages (not updated) LS1 Activities Hardware Developments Software Operational Safety LS1 Cooling Piquet Schedule ...
VELO Software Tasks and contact persons List of tasks and contact persons Useful links browser usage guidelines: How to commit code, tag it and edit ...
VELO Software Tasks and Contact Persons The VELO software activities are divided into tasks . The list below details all tasks and contact persons: VELO Software ...
T14 (T35 450 P4) Description 200 m 3 x 1 n on p sensor from Hamamatsu bump bonded to Timepix3 ASICs. 450 m inactive edge, 35 m implant width. Parylene ...
Timepix3 testbeam offline software Coordination: Tim Evans, Heinrich Schindler, Hella Snoek The Timepix3 test beam offline analysis software is based on the Gaudi ...
Telescope Run Date Time Run Info 6733 2015 07 08 23:35:02.88 looking for 6734 2015 07 08 23:36:05.14 looking for 6735 2015 ...
VELO Upgrade Testbeam 2014/2015 Test beam coordination: Hella Snoek / Kazu Akiba (2015) Technical coordination: Martin van Beuzekom Kepler coordination: Tim Evans ...
VELO Upgrade sensor simulations Installing Sentaurus TCAD Step 1: Setting up an Openstack virtual machine Perfom the steps below by using this tutorial ...
SMOG as a Fixed target in the LHC The potential use of SMOG as a fixed target in the LHC is become increasingly popular. Here is some information about this conjecture ...
T13 (T35 450 P3) Description 200 m 3 x 1 n on p sensor from Hamamatsu bump bonded to Timepix3 ASICs. 450 m inactive edge, 35 m implant width. Parylene ...
T11 (T35 450 P9) Description 200 m 3 x 1 n on p sensor from Hamamatsu bump bonded to Timepix3 ASICs. 450 m inactive edge, 35 m implant width. Parylene ...
T10 (T35 450 P6) Description 200 m 3 x 1 n on p sensor from Hamamatsu bump bonded to Timepix3 ASICs. 450 m inactive edge, 35 m implant width. Parylene ...
S16 (S35 450 P1) Description Timepix3 W0009 D03 with 200 m n on p sensor from Hamamatsu. 450 m inactive edge, 35 m implant width. Glued on ceramic ...
S6 (S39 450 P1) Description Timepix3 W0009 F10 with 200 m n on p sensor from Hamamatsu. 450 m inactive edge, 39 m implant width. Glued on ceramic ...
VELO Upgrade Conference Material This page is updated with useful figures and diagrams for preparing presentations. Many figures come from the Upgrade TDR, which is ...
S25 (MS 450 P3) Description Timepix3 W0005 F09 with 200 m n on p sensor from Micron. 450 m inactive edge, 36 m implant width. Parylene coated (before ...
S31 (MS 250 P1) Description Timepix3 W0009 E7 with 200 m n on p sensor from Micron. 250 m inactive edge, 36 m implant width. Parylene coated (before ...
S23 (MS 450 P1) Description Timepix3 W0009 H11 with 200 m n on p sensor from Micron. 450 m inactive edge, 36 m implant width. Parylene coated (before ...
S24 (MS 450 P2) Description Timepix3 W0009 G04 with 200 m n on p sensor from Micron. 450 m inactive edge, 36 m implant width. Parylene coated (before ...
T12 (T35 450 P10) Description 200 m 3 x 1 n on p sensor from Hamamatsu bump bonded to Timepix3 ASICs. 450 m inactive edge, 35 m implant width. Parylene ...
ATTENTION! ATTENTION! ATTENTION! ATTENTION! ATTENTION! ATTENTION! ATTENTION! RUN PLAN FOR S24! MICRON n on p JSI IRRADIATED ATTENTION! ATTENTION! ATTENTION ...
ATTENTION! ATTENTION! ATTENTION! ATTENTION! ATTENTION! ATTENTION! ATTENTION! RUN PLAN FOR S6! HAMAMATSU COATED JSI IRRADIATED ATTENTION! ATTENTION! ATTENTION ...
KazuyoshiCarvalhoAkiba 2015 07 27 ATTENTION! ATTENTION! ATTENTION! ATTENTION! ATTENTION! ATTENTION! ATTENTION! RUN PLAN FOR S23! MICRON n on p JSI IRRADIATED ATTENTION ...
Test beam analysis Topic Group Person Comments Clusters Charge sharing, broken clusters Bristol Noisy/dead pixels CERN Mark ...
S4 (S39 600 P1) Description Timepix3 W0009 D10 with 200 m n on p sensor from Hamamatsu. 600 m inactive edge, 39 m implant width. Parylene coated ...
T1 (T35 450 P1) Description 200 m 3 x 1 n on p sensor from Hamamatsu bump bonded to Timepix3 ASICs. Chip positions 450 m inactive edge, 35 m ...
T2 (T35 450 P1) Description 200 m 3 x 1 n on p sensor from Hamamatsu bump bonded to Timepix3 ASICs. Chip positions 450 m inactive edge, 35 m ...
T21 (MT 450 P5) Description 150 m 3 x 1 n on n sensor from Micron bump bonded to Timepix3 ASICs. Chip positions 450 m inactive edge, 36 m implant ...
T6 (T35 600 P1) Description 200 m 3 x 1 n on p sensor from Hamamatsu bump bonded to Timepix3 ASICs. Chip positions 600 m inactive edge, 35 m ...
S34 (MS 250 P2) Description Timepix3 W0002 G01 with 150 m n on n sensor from Micron. 250 m inactive edge, 36 m implant width. Glued on ceramic substrate ...
S30 (MS 450 P4) Description Timepix3 W0005 K03 with 150 m n on n sensor from Micron. 450 m inactive edge, 36 m implant width. Glued on ceramic substrate ...
S11 (S39 450 P2) Description Timepix3 W0009 H06 with 200 m n on p sensor from Hamamatsu. 450 m inactive edge, 39 m implant width. Parylene coated ...
S8 (S35 450 P3) Description Timepix3 W0009 G08 with 200 m n on p sensor from Hamamatsu. 450 m inactive edge, 35 m implant width. Parylene coated ...
S27 (MS 450 P1) Description Timepix3 W0005 H01 with 150 m n on n sensor from Micron. 450 m inactive edge, 36 m implant width. Glued on ceramic substrate ...
S22 (S35 450 P1) Description Timepix3 W0009 J02 with 200 m n on p sensor from Hamamatsu. 450 m inactive edge, 35 m implant width. Parylene coated ...
S33 (MS 250 P1) Description Timepix3 W0002 H04 with 150 m n on n sensor from Micron. 250 m inactive edge, 36 m implant width. Glued on ceramic substrate ...
T15 (MT 450 P1) Description 200 m 3 x 1 n in p sensor from Micron bump bonded to Timepix3 ASICs. 450 m inactive edge, 36 m implant width. Parylene ...
T17 (MT 450 P5) Description 200 m 3 x 1 n in p sensor from Micron bump bonded to Timepix3 ASICs. 450 m inactive edge, 36 m implant width. Parylene ...
S14 (S39 450 P1) Description Timepix3 W0009 F04 with 200 m n on p sensor from Hamamatsu. 450 m inactive edge, 39 m implant width. Glued on ceramic ...
KazuyoshiCarvalhoAkiba 2015 07 25 ATTENTION! ATTENTION! ATTENTION! ATTENTION! ATTENTION! ATTENTION! ATTENTION! RUN PLAN FOR T1! IRRADIATED AT KIT HAMAMATSU SENSOR ...
KazuyoshiCarvalhoAkiba 2015 07 25 ATTENTION! ATTENTION! ATTENTION! ATTENTION! ATTENTION! ATTENTION! ATTENTION! RUN PLAN FOR S30! MICRON N ON N NON IRRADIATED ...
KazuyoshiCarvalhoAkiba 2015 07 25 ATTENTION! ATTENTION! ATTENTION! ATTENTION! ATTENTION! ATTENTION! ATTENTION! RUN PLAN FOR S16! IRRADIATED AT KIT HAMAMATSU SENSOR ...
Lab Information (working progress....) Location, Location, Location Location of Equalisation Scripts /home/timepix3/SPIDR/SPIDR/software/trunk/Telescope ...
ATTENTION! ATTENTION! ATTENTION! ATTENTION! ATTENTION! ATTENTION! ATTENTION! RUN PLAN FOR S30! MICRON N ON N NON IRRADIATED 450 GUARD RINGS ATTENTION! ATTENTION ...
Shift start/end When you start your shift inform yourself by talking to the previousshift. What happened, where are they in the run plan, are there special instructions ...
VELO Data Quality Testbeam and Zap Testbeam 2006 2007 2008 2009 2011 2012 2014/2015 High Rate Tests 2008 ...
Velo Upgrade Technology Review: May 22 23 Nikhef Amsterdam agenda page Repository Document to guide referees through review process preliminary version referee ...
LHCb VELO Upgrade The upgraded LHCb VELO silicon vertex detector is a lightweight hybrid pixel detector capable of 40 MHz readout at a luminosity of 2 x 1033 ...
Theses and Reports Tuomas Poikela of Turku PhD Thesis Veerle Heijne Nikhef Master Thesis Atreyi Bhattacharya Indian Summer Student Report Tuomas ...
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Topic revision: r1 - 2006-11-15 - TWikiContributor
 

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